NP1025 is a two part thermally conductive epoxy resin system with a low mix viscosity. The mixed system has a long pot life and can be cured at ambient or elevated temperatures. The flexibility of the resin and the very high filler loading make this system ideal for applications where temperature cycling and thermal stresses are encountered.
- Very High Thermal Conductivity
- Ambient or Elevated Temperature Dispensing and Curing
- Contains No Halogens and is Non-Toxic.
- Low Stress on Components