Applications

In response to the rapidly developing market using Light Emitting Diodes (LEDs), ALH Systems Limited have defined and expanded the product range to meet the ever increasing requirements of LED product manufacturers. The LED epoxy and polyurethane potting compounds are used in applications from specialised lighting to LED indicators that are incorporated into other products. From very high thermally conductive epoxy potting compounds to flexible polyurethanes that seal out moisture and contaminants over a large temperature range, ALH Systems can help to select the proper material for your LED encapsulation application.

ALH offer a good selection of Epoxy and Polyurethane resins for potting and encapsulating components, these resins can be used to protect product or to prevent intervention.

Reaction Injection Moulding or RIM involves bringing together two highly reactive liquid monomers into a mixhead and immediately injecting them into a heated mould under low pressure.

ALH Systems is a market leader in thermal management resins. Advanced polymer formulations combine novel fillers and dispersion techniques to present very high thermal conductivity values with relatively low mix viscosities.

Adhesives are becoming the preferred method of joining components and materials together as it is a quick and easy process that can offer greater befits over mechanical fixings.

Many applications require resins that perform at ever higher, or lower, temperatures and often both. ATEX and BASEEFA tests also apply thermal shock between these temperature extremes.

Duct Sealants for vertical and horizontal pipes to prevent gas and water ingress.

An expanding range of flame retardant resins to the level of UL 94 V-0 is presented. They are also thermally conductive and do not contain halogens.

Marine and other outdoor applications may require water resistant resins that maintain electrical properties (such as low dielectric loss) in continuous immersion situations.

There are often occasions when it is necessary to able to access a component in an electronic system after the system has been “potted”.

ALH Systems provide potting and encapsulation resins that are Underwriter Laboratory Approved with UL 94 V-0 ratings.