The NP1010 General Purpose Epoxy Resin is a high-performance, two-part epoxy resin system designed for potting, encapsulation, and electrical protection applications. Engineered to deliver excellent flame retardance, electrical insulation, and mechanical durability, NP1010 is an ideal solution for demanding industrial and electronic environments where reliability and safety are critical.

This versatile epoxy resin offers a balance of medium viscosity, good gloss finish, and controlled cure speed, making it suitable for both small-scale assemblies and larger production runs. The system is approvable to the UL 94 V-0 flame retardance standard, providing confidence for use in safety-critical electrical and electronic components.

High-Performance Epoxy Resin for Electrical Protection

NP1010 epoxy resin is specifically formulated as an electrical insulating epoxy, delivering excellent dielectric and thermal properties. With a volume resistivity of 10¹⁴ ohm.cm and an electrical strength of approximately 15 kV/mm, it provides long-term protection against electrical leakage, short circuits, and environmental stress.

The cured resin demonstrates a Shore D hardness of 80, ensuring mechanical robustness while maintaining dimensional stability. With an operating temperature range from -40°C to +130°C (continuous, geometry dependent), this epoxy resin performs reliably across a wide range of service conditions.

Flame Retardant and Safety-Focused Formulation

Safety is a core feature of the NP1010 epoxy resin system. It is UL 94 V-0 approvable at 6 mm, offering high flame retardance for applications where fire performance is essential. The formulation contains no SVHCs (Substances of Very High Concern), supporting compliance with modern regulatory and environmental requirements.

Low cure shrinkage (approximately 4% by volume) helps protect sensitive components during encapsulation, reducing stress on PCBs, batteries, and assemblies.

Processing and Application Benefits

NP1010 epoxy resin is supplied as a two-part system with a clearly defined mix ratio of 4.7:1 by volume (or 8.5:1 by weight), ensuring accurate and repeatable processing. The system offers a pot life of 45–60 minutes at 23°C, allowing sufficient working time for complex potting and encapsulation tasks.

Cure schedules are flexible to suit production needs, with full cure achieved in:

• 48 hours at 23°C

• 16 hours at 40°C

• 4 hours at 60°C

The medium mixed viscosity (~8,500 mPas) allows the epoxy resin to flow effectively around components while minimising air entrapment, particularly when used in twinpack or pre-weighed kit formats.

Typical Applications

The NP1010 general purpose epoxy resin is suitable for a wide range of industrial and electronic uses, including:

• Electronic assemblies

• Printed circuit boards (PCBs)

• Battery systems and modules

• General potting and encapsulation of electrical components

Packaging, Storage, and Supply Options

NP1010 epoxy resin is available in twinpacks, kits, and bulk supply formats, supporting both prototyping and volume manufacturing. When stored unopened in original containers at 10–25°C, the system offers a shelf life of up to 12 months.